Ecompass LLP

Sn63/Pb67 Low Temperature PPD 183°C Sealed Low Dross Tin Solder BGA Paste for SMD Rework and Circuit Assembly

This is solder paste for soldering small SMD components in reflow oven or with hot air soldering station. comes in a small container for prototyping or repairing job. This pack is right amount of solder paste for most of the hobby projects. This paste is replacement of solder wire used in Through hole soldering, some times solder flux is referred as solder paste. This solder paste comes in a special container, when it is sealed, it can survive for 6 months. If you open the container and want to store rest of the paste for future use make sure it is tight and place it in a plastic zipper pouch and place it in the refrigerator. 

Specifications:-

• Brand: Mechanic
• Alloy : Sn63/Pb37
• Microns : 3#
• Flux IPX3

* Product Images are shown for illustrative purposes only and may differ from actual product.

Professional MECHANIC X6 X8 X9 Rosin Flux Paste 20g for Precise Soldering & BGA Rework

Improve your soldering performance with the MECHANIC X6 / X8 / X9 Rosin Flux Paste (20g). Designed for PCB repair, BGA rework, SMT assembly, and precision electronics soldering, this high-quality rosin-based flux enhances solder wetting, prevents oxidation, and ensures strong, reliable joints.

With mild pH, non-corrosive formulation, and transparent low-residue finish, it is ideal for professional technicians and DIY electronics enthusiasts alike.

Key Features

• High-quality rosin-based flux formulation

• Mild pH – safe for IC and PCB

• Non-corrosive & non-conductive

• Transparent residue – no washing required

• Improved anti-oxidation performance

• Smooth solder flow & enhanced wetting

• Suitable for electric soldering iron & hot air rework

• Compact 20g packaging for easy handling

Technical Specifications Applications

• PCB soldering

• BGA chip rework

• Smartphone motherboard repair

• SMT & SMD assembly

• Electronic parts repair

• Prototype development

• Oxidation removal before soldering

• Reflow & hot air soldering

Precautions

• Store in a cool, dry place

• Avoid direct sunlight

• Use in a well-ventilated area

• Keep away from children

• Do not ingest

• Clean work area after soldering if required

Professional High-Activation BGA Flux Paste for Precision Soldering & Rework

The MECHANIC TF350 Special Flux Paste is specially formulated for professional BGA (Ball Grid Array) soldering, rework, and PCB repair applications. Designed for technicians and electronics repair experts, this high-activity flux ensures superior solder wetting, smooth reflow, and strong, reliable solder joints.

Whether you are performing BGA chip replacement, SMT assembly, or motherboard repair, TF350 provides excellent oxide removal, improved heat transfer, and consistent performance across various temperature profiles.

Perfect for mobile repair labs, service centres, electronics workshops, and industrial rework stations.

Key Features

• High activation formula for effective oxide removal
• Excellent solder wetting and smooth reflow performance
• Non-corrosive and non-conductive formulation
• Minimal residue and easy post-cleaning
• Wide temperature compatibility
• Improves heat transfer during reflow
• Reduces solder bridges and voids
• Ideal for BGA, SMT, and PCB repair
• Smooth paste consistency for precise application
• Professional-grade reliability

Technical Specifications Applications

• BGA soldering and reballing
• BGA chip removal and replacement
• SMT component assembly
• Motherboard repair
• PCB rework and maintenance
• Pre-solder surface cleaning
• Prototype development
• Electronics training and lab use
• Heat-assisted reflow processes

How to Use

1. Clean PCB pads and BGA balls thoroughly.

2. Apply a small amount of TF350 flux paste to solder area.

3. Position the BGA component accurately.

4. Heat using reflow oven, hot air station, or soldering tool.

5. Allow natural cooling.

6. Clean residue with IPA if required.

Precautions

• Store in a cool, dry place
• Avoid direct sunlight exposure
• Use in a well-ventilated area
• Keep away from children
• Do not ingest
• Clean residue after soldering for best performance
• Avoid rapid cooling to prevent thermal stress

MECHANIC Solder Paste for SMD, BGA & SMT Rework

MECHANIC V-series solder pastes (V3B45, V4B45, V5B45, V6B45, V8B45) are primarily low-temperature (138°C) lead-free pastes designed for SMD/BGA rework, offering excellent wettability and strong adhesion. 
Achieve clean, reliable, and professional solder joints with MECHANIC Solder Paste, specially formulated for SMD, BGA, and SMT stencil welding applications. Designed for use with rework stations and precision soldering tasks, this high-performance paste ensures excellent wetting, smooth reflow, and strong electrical connections.

Available in multiple variants, it is ideal for PCB repair, motherboard rework, and advanced electronics assembly.

The primary differences are in package size (e.g., 20g vs 60g) and specific particle size distribution (powder mesh) for stencil printing Vs. manual needle application.

Key Features:

• High-quality solder paste for SMD, BGA, and SMT

• Smooth reflow performance with strong bonding

• Excellent wetting and oxidation resistance

• Suitable for stencil printing and rework stations

• Minimal residue after soldering

• Stable performance for precision electronics

• Ideal for PCB repair and assembly work

• Available in multiple weight options

Technical Specifications Applications

• SMD component soldering

• BGA chip reballing and rework

• SMT stencil printing

• PCB repair and prototyping

• Motherboard and mobile repair

• Industrial electronics assembly

• Laboratory and training use

Precautions

• Store in a cool and dry place

• Keep sealed when not in use

• Avoid direct sunlight exposure

• Use a proper temperature profile during reflow

• Wear protective gloves when handling

• Keep away from children